Samsung is going to unveil the Galaxy Z Flip 6 at its Galaxy Unpacked event on July 10 in Paris. On the eve of the presentation, a global version of the Z Flip 6 has appeared on the Geekbench benchmarking website, which contains detailed information about the device’s capabilities.
The global/European model of the Galaxy Z Flip 6, model number SM-F741B, scored 2247 points for single core and 6857 points for multi-core on Geekbench. These results emphasize the device’s octa-core processor and 12 GB of RAM, which indicates a fast and smooth user experience. The smartphone will be launched with Android 14 operating system.
The list mentions the Qualcomm Snapdragon 8 Gen 3 Made for Galaxy SoC, with a customized pineapple motherboard for better performance. The SoC includes different cores to optimize speed and efficiency, as well as an Adreno 750 GPU for graphics. Unfortunately, the report does not reveal any other details. However, a recent report leaked the full list of Galaxy Z Flip 6 specifications.
Samsung Galaxy Z Flip 6 specifications (leak):
According to the leak, the Galaxy Z Flip 6 will feature a 6.7-inch Dynamic AMOLED 2X display with a resolution of 2640 x 1080 and a refresh rate of 120 Hz. It also has a 3.4-inch display on the cover with a resolution of 720 x 748. It is powered by the Snapdragon 8 Gen 3 for Galaxy chipset with the same clock speed as the Galaxy S24 series, with cores at 3.39 GHz, 3.1 GHz, 2.9 GHz and 2.2 GHz. The storage capacity is 256 GB and 512 GB.
The phone’s camera includes a 50MP f/1.8 primary camera, a 12MP f/2.2 ultra-wide-angle camera, and a 10MP front-facing camera without autofocus. It supports 4K 60fps video recording, 1080P 60fps video recording, and slow motion 1080P 120fps or 240fps video recording. Connectivity features will include Wi-Fi 6E, Bluetooth 5.3, and USB 3.2 Gen 1.
According to the report, the Z Flip 6 folds down to a compact 85.1 x 71.9 x 14.9 mm and weighs 187 g when unfolded (165.1 x 71.9 x 6.9 mm). It has a 4000 mAh battery with 25W fast charging capability.
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