Today, Redmi CEO Wang Teng Thomas posted a video on Weibo in which he talked about the upcoming Redmi K70 Ultra for the Chinese market. In the video, he talks to Xiaomi founder and CEO Lei Jun. Wang Teng Thomas revealed that he is fully prepared for the launch of the K70 Ultra. He shared some key details about the device.
Redmi K70 Ultra, like its predecessor, the Redmi K60 Ultra, will be a performance-oriented phone. It will be the “performance king” in the 3,000 yuan (~$412) price range. According to reports, the K70 Ultra will be equipped with the Dimensity 9300 Plus chipset. This is the same chip that is used in the iQOO Neo 9S Pro, which debuted a few weeks ago in China.
Wang Teng Thomas also noted that in addition to the main chip, the Redmi K70 Ultra will have a powerful independent graphics chip and an ice-sealed cooling system. Above is the retail box for the K70 Ultra that Thomas shared on Friday.
The brand recently confirmed that the Redmi K70 Ultra will be a dust and water resistant device with an IP68 rating. According to reports, it will have a flat 8-inch OLED panel with a resolution of 1.5 thousand pixels and a refresh rate of 144 Hz. For greater durability, it will have a metal center frame.
The D9300+-based phone is expected to have up to 24GB of LPDDR5x RAM, up to 1TB of UFS 4.0 storage, and a 5500mAh battery with 120W fast charging. It may have a 20-megapixel front-facing camera for selfies and a triple camera on the back with a resolution of 50MP + 8MP + 2MP.
For those who don’t know, a revised version of the Redmi K70 Ultra with better cameras called Xiaomi 14T Pro is expected to debut on the global market in the coming weeks.
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