Leading Japanese chip material maker Resonac Holdings Corp. said Monday it will form a consortium with nine other Japanese and U.S. firms to collaborate over the development of technologies deemed key in manufacturing state-of-the art semiconductors used for generative artificial intelligence. The consortium, called US-JOINT, will be based in Silicon Valley, setting its main focus on developing so-called back-end technologies of packaging semiconductors. Its facility is expected to become fully operational next year. “Today’s rapidly expanding next-generation semiconductors for generative AI a…