A report from the Chinese microblogging site Weibo reveals some key features of the Redmi K70 Ultra. The phone has already received the 3C certificate and is getting ready to launch as the successor to the Redmi K60 Ultra, which was unveiled back in August last year. So let’s find out the details about the upcoming Ultra model.
According to the source, the phone will run on the Dimensity 9300 Plus chipset. In comparison, the Redmi K70 Pro, launched in November last year, is powered by the Snapdragon 8 Gen 3 chipset. The Ultra model will reportedly also include the X7 independent display chip, which was also adopted in the Redmi K60 Ultra. Last month, another Weibo Smart tipster Pikachu also mentioned the use of an independent display chip. The chipsets will be powered by a 5000mAh battery, and the phone will support 120W fast charging. According to previous rumors, the phone may offer 24GB of LPDDR5X RAM and 1TB of UFS 4.0 storage.
The exterior will have an OLED panel with a resolution of 1.5K 144 Hz, which will be surrounded by a metal middle frame. The back panel will be glass.
Speaking of cameras, the rear panel will feature a 50-megapixel Light Hunter 800 (OVX8000) main sensor, an 8-megapixel ultra-wide-angle sensor, and an additional 2-megapixel sensor (possibly a depth sensor). It is also possible to cooperate with Leica for better image processing. The main sensor (Light Hunter 800) has a size of 1/ 1.55″ and offers a native dynamic range of 13.2EV.
Redmi K70 Pro was the first to launch the Light Hunter 800 sensor, which is also used in the recently released Xiaomi Civi 4 Pro smartphone.
Last month, a Xiaomi device with the model number 2407FRK8EC appeared on the 3C certification platform, which, judging by the specifications, is the Redmi K70 Ultra.
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