-E Ink (8069.TW) the originator, pioneer, and global commercial leader in ePaper technology, today announced it is collaborating with ecosystem partners Realtek Semiconductor (Realtek), Integrated Solutions Technology (IST), and Chipbond Technology Corporation (Chipbond) to develop the System on Panel (SoP) architecture. This technology will be integrated into the next-generation electronic shelf label (ESL) jointly developed with the system integrator, SOLUM. In order to simplify the material structure of ESL, this collaboration aims to bring a sustainable solution via reduced material usage,…