Taiwan Semiconductor (NYSE:TSM) is reportedly considering expanding its advanced chip packaging capacity in Japan, which could significantly impact the global semiconductor industry. What Happened: TSMC is exploring the possibility of establishing advanced packaging facilities in Japan, sources familiar with the matter informed Reuters. The discussions are preliminary, and no official decisions have been made. The company is contemplating introducing its chip-on-wafer-on-substrate (CoWoS) packaging technology in Japan. This technology involves stacking chips on top of each other, which enhance…