Taiwan Semiconductor Manufacturing Co (NYSE:TSM) is reportedly exploring a new method of advanced chip packaging to meet the growing AI-driven demand for computing power. The key Nvidia Corp (NASDAQ:NVDA) and Apple Inc (NASDAQ:AAPL) supplier is collaborating with equipment and material suppliers on this new technique, which could take several years to commercialize. The innovation involves using rectangular panel-like substrates instead of the traditional round wafers, enabling more chip sets per substrate, the Nikkei Asia reports. TSMC stock is trading higher Thursday. The rectangular substra…