Qualcomm will unveil Snapdragon 8 Gen 4, its next-generation flagship smartphone chipset, in October this year. A few months before the official announcement, a leaked spec sheet revealed its key details.
According to the leaked specification, the upcoming Snapdragon 8 Gen 4 chipset has two SKUs, namely SM8750 and SM8750P. The former is a regular version of the chipset, while the latter is an overclocked version.
The specification also states that Qualcomm will manufacture the Snapdragon 8 Gen 4 chipset using an advanced 3nm process, which promises significant improvements in performance and energy efficiency. It will feature Qualcomm’s latest Oryon processor, designed to deliver high-performance computing, and the Adreno 8 series GPU, which is designed to deliver the highest level of graphics capabilities ideal for gaming and other demanding tasks. The chipset supports dual-channel high-speed LPDDR5X SDRAM with packet-in-packet (PoP) technology, which further enhances its performance.
In terms of multimedia, the Snapdragon 8 Gen 4 will be equipped with Qualcomm Spectra ISP 8-series processors, which are expected to significantly improve the quality of photo and video shooting on mobile devices. In addition, it includes Adreno VPU and DPU units, which will be responsible for encoding and decoding UHD video, as well as supporting high-definition displays.
The Snapdragon 8 Gen 4 will also have excellent connectivity features. It integrates a 3G/4G/5G modem capable of supporting mmWave and sub-6 bands. In addition, it includes Qualcomm’s FastConnect 7900 system, which supports the latest wireless technologies such as Wi-Fi 7, Bluetooth 5.4, and ultra-wideband (UWB).
In addition to its strong power and connectivity capabilities, the Snapdragon 8 Gen 4 will have advanced artificial intelligence and security features. It will have a Low Power AI (LPAI) subsystem with a dedicated DSP and AI accelerator that enables continuous AI processing on the device without compromising battery life.
Audio enthusiasts will also appreciate the Qualcomm Aqstic WCD3955 audio codec, which supports audiophile sound quality. Finally, the inclusion of a secure processing unit indicates that Qualcomm prioritizes advanced security features, making this chipset not only powerful but also secure for a wide range of demanding use cases.
The SM8750 version is expected to be used in most flagship phones expected to be launched in October-December in China. The SM8750 variant will be used in the Galaxy S25 Ultra, which is expected to launch in January 2025. It is possible that the SM8750P version will be used in other flagship phones that will be released in China around mid-2025.
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