On May 27, Honor will launch Honor 200 and 200 Pro smartphones in China. Ahead of the launch, the brand has already shown the design of both smartphones. However, it did not confirm their key features. A new leak from a Chinese source has revealed the chipsets that will power the Honor 200 duo.
A previous report claimed that the Honor 200 will be powered by a Snapdragon 8s Gen 3, while the Pro model will have a Snapdragon 8s Gen 3 on board. The new leak refutes the previous one, as it claims that the Honor 200 will be equipped with an improved version of the Snapdragon 7 Gen 3. Currently, the third generation of Qualcomm’s Snapdragon 7 includes two models: Snapdragon 7 Gen 3 and the more powerful Snapdragon 7+ Gen 3. It is unclear how the Snapdragon 7 Gen 3 Enhanced Version will differ from the existing models.
On the other hand, Honor 200 Pro will be equipped with the Snapdragon 8 Gen 3 chipset. As a reminder, Honor 100 and 100 Pro, which were announced in November 2023, were equipped with Snapdragon 7 Gen 3 and Snapdragon 8 Gen 2 chipsets, respectively.
The Honor 200 and 200 Pro were reported to have a 5,200 mAh battery with 100W fast charging. The two phones are expected to differ in terms of RAM and storage. It is likely that both phones will have a 50-megapixel primary camera with OIS support. On the front, both phones seem to have OLED panels with a quadrangular curve. While the standard model has a single selfie camera, the Pro edition has two front-facing cameras.
By the way, Honor may be working on two foldable phones, such as Magic V Flip and Magic V3. The V Flip, which will be Honor’s first phone with a foldable flip display, is expected to be officially unveiled in June in China, and the V3 may be introduced in July. There is currently no information on the global launch of these devices.
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