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Huawei’s upcoming flagship Mate 70 will reportedly use 7nm Kirin chips due to the high cost and potential productivity issues associated with SMIC’s attempt to switch to a 5nm process using DUV. SMIC is a leading chipmaker in China and is facing restrictions due to US sanctions and Dutch export restrictions. Without access to advanced EUV technology, SMIC relies on older DUV machines, which puts them behind competitors TSMC and Samsung Foundry.

Despite the difficulties, rumors indicate that SMIC is actively working on a 5nm process using DUV lithography. While the energy efficiency of this approach looks promising, significant cost reductions are needed to make it commercially viable for Huawei.

The choice of chipset for the Mate 70 remains unclear. The use of 7nm offers a safe path, while the transition to a 5nm process based on DUV promises progress, but is associated with significant risks. SMIC’s success in perfecting the 5nm process will ultimately determine Huawei’s chip strategy for future flagships.

The post Huawei will use 7nm Kirin chips for the upcoming Mate 70 smartphone first appeared on HiTechExpert.top.