MWC 2024 is officially here, and chipset giant Qualcomm has kicked off the show with the announcement of the first-ever 2×2 chip to combine Wi-Fi, Bluetooth, and Ultra-Wideband (UWB). It’s also enhanced with AI, of course. The Qualcomm FastConnect 7900 is expected to launch in the second half of this year, and it sounds like a big deal. According to Qualcomm, the Wi-Fi system will adapt to different environments and use cases to deliver the best performance possible across a range of devices. It also supposedly has 40% less power usage than the previous generation. The advanced proximity aware…