Redmi is reportedly working on a series of Note 14 smartphones for China. The company is likely to release them in August or September. Earlier this month, a Digital Chat Station insider published a post on Weibo to reveal the design of the Note 14 Pro. A previous leak from the same insider also revealed that the upcoming Snapdragon 7s Gen 3 will power the device. In a new Weibo post published today, DCS seems to have suggested that the Note 14 Pro+ will have a Dimensity chip on board.
Redmi Note 14 Pro+ key details leaked online
In the aforementioned post on Weibo, DCS did not reveal the name he is talking about. However, it seems that he could be talking about one of the Note 14 series smartphones. As the insider described the device as having a “super bowl” in the leak, it seems that he could be talking about the Redmi Note 14 Pro+.
The insider claims that the Note 14 Pro+ will have a plastic frame and an optical fingerprint sensor on the screen for security. Under the hood, the Pro+ model will have a Dimensity chipset based on TSMC’s second-generation 4nm process with a core frequency of 3 GHz. In his comments, he suggested that the device is powered by the Dimensity 7350 chipset. This is the same chip that powers the upcoming Nothing Phone (2a) Plus, which is set to launch on July 31 in India.
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